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`REPARED
BY:
DATE
SPEC
No. No.
ED-93032
SHARP
ELECTRONIC SHARP COMPONENTS CROUP CORPORATION
PILE ISSUE PACE
April 12
9, Pages DIVISION
1993
REPRESENTATIVE 0 PHOTOVOLTAICS baOPTO-ELECTRONIC 0 ELECTRONIC
DIV. DEVICES DI' COMPONENTS DIV.
SPECIFICATION
0 0
1.
This specification sheets include the contents Sharp Corporation ("Sharp"). Please keep them important information. Please don't reproduce them \;i'thout Sharp's consent, ?lease ( :; This Main obey the instructions mentioned below for
under the copyright of with reasonable care as or cause anyone reproduce
2.
actual equipment.
use
of
this
device.
device is designed uses of this device
l
for general electronic are as follows;
. Computer OA equipment -Telecommunication * Measuring equipment *Tooling machine etc. c * Home appliance, (2) Please take in case this high reliability. proper device steps in is used
.AV
equipment equipment
(Terminal) I and which safety, require
order to maintain reliabflity for the uses mentioned belov
-Unit concerning control and safety of automobile etc.) *Gas leak detection box and burglar alarm box [ *Fire *Other 0) Please extremely don't high use for the reliability uses mentioned
a vehicle breaker safety below
(air plane, * Traffic equipment, which require
train,
signal etc.
3
.Telecommunication . Medical element), etc.
equipment equipment
(Trunk) (relating
to
any
fatal
1
0 CUSTC.LIER'S
APPROVAL
PRESENTED BY T. Fla tsrimura , Department General Engineering Dept., Opto-Electronic ELECOM Group SHARP CORPORATION
DATE
Manager of TI Devices Div.
BY
PAGE
1.
Application This specification photocoupler Model applies to the No. PC3Q64. outline and characteristics of
2.
Outline Refer to the attached drawing No. CY5888K02.
3.
Ratings 3.1
and characteristics maximum ratings Ta=25'C Parameter *l Forward current current ! ! voltage voltage I dissipation Symbol IF IFM p VCEO VECO Ic PC / i i 1 I 1 I I Rating +50 21 70 35 6 50 150 ! j I 1 i j Unit ; 1 mA A mW V vi ( I I
Absolute
1
, Input
*2 *l
Peak forward Power dissipation
1 I !Output , I *l *l
Collector-emitter Emitter-collector Collector Collector Total power current power
;mt; ,i ! mW i I
dissipation temperature
Operating
*1 *2 *3 *4
The derating temperature Pulse AC for For width
factors of absolute maximum rating are shown in Fig. 1 'L 4. 5 lOOps, Cuty ratio : 0.001 (Refer
due to ambient to Fig. 5)
1 min.,
40 "u 60%RH, f=60Hz
10 s
3.2
Electra-optical
characteristics Ta=25"C
Input
Parameter Forward voltage capacitance
Terminal Dark output
j Symbol MIN. / "F ___-._./ j ct I'CEO BVCEO I / BVECO I 1 I Ic 1 / i35 6 0.2
' TYP. 1.2 1 /I
MAX. 1 Unit/ f 1.4 j 250 1 100 : "
Conditions
30
'IF='2Oti I i pF $=O, f=lkHz ;d 1 I ; ; /d I / ' &E=20",
,
/ I I j IF=0 I
current
Collector-emitter breakdown voltage Emitter-collector brakdown voltage Collector current
j1
1/ ] 4.0 j j 0.2 ! /I
v /Ic=O.lmA j IF=0 " ;I~=l@ki, I &=tld /"CE=5" IF=0 1 I 1 ; 1 I /
Collector-emitter saturation voltage Transfer characteristics Isolation Floating Response Response resistance capacitance time time (Rise) (Fall)
'"CE(sat) Riso i Cf
I
i5x1010 -
10.1 j
loll I 0.6
/
1.0
1
" i1F=+20ti /Ic=lmA 1 1 $rj iDC500V /40 ?r 60%RH 1 I i pF fV=O, f=lMHz j ,,s VCE=2V I Ic=2mA , 1 us lRL=lOOO I
i
tr 1 I tf
'
4
1 18 j / 18
13
I
IMODEL No.
(PAGE
I
4. Reliability Refer to the attached sheet, Page 7.
PC3Q64
I
3
5.
Incoming Refer
inspection to the attached sheet, Page 8.
6.
Supplements 6.1 (1) (2) Isolation voltage shall be measured in the following side side. circuit method. and shall
Short between anode and cathode on the primary between collector and Emitter on the secondary The dielectric be used, withstand tester with zero-cross
(3)
The waveform of applied (It is recommended that in insulation oil) This (I) (2) (3) product This This This is AC input is not is
voltage shall the isolation
be a sine wave. voltage be measured
6.2 6.3
type. designed with as radiation electrical light hardened. input and output. diode.
product product product specifications
assembled
incorporates
non coherent
emitting
6.4
Package Refer
to the
attached
sheet,
Page
9 to 11.
6.5
UL : Under
preparation
jh4ODEL
No.
1 PAGE
.
I
7. Notes 7.1 For cleaning * Cleaning (1) (2) Solvent Ultrasonic conditions: cleaning: cleaning: Solvent te perature 45C Immersion 3 min. or less
PC3Q64
I
4
or less
Affection to device by ultrasonic cleaning has different affection by cleaning bath size, ultrasonic power output, cleaning time, PWB size or device mounting condition etcIf user carries out ultrasonic cleaning, user should select fit condition that doesn't occur defect. be carried Ethyl Freon out with solvent below. Isopropyl S3-E alcohol
* The cleaning Solvent:
shall
alcohol, TE.TF,
Methyl alcohol, Daiflon-solvent
Please refrain from using Chloro Fluoro Carbon type solvent to clean devices as much as possible since it is restricted to protect the ozonosphere. Before you use alternative solvent you are requested to confirm that it does not damage package resin. 7.2 On mounting In mounting this device, please perform soldering reflow satisfied with the conditions indicated in page 12. And please pay attention not to occur the temperature rising of the package sectionally.
8.
Others Any doubt as to this specification upon mutual consultation of the both shall be determined parties. in good faith
SHARI=
Date I--code *l Iiurr -i 1lax. 0.2
PC3Q64
Page
5
l-t
T
Pin Nos* connection e Q@
and internal diagram @Qa aDQ!J @
P C 3 Q.6 4
Q
m d $1 4
-.-cu d -
d
l tl WI
Epoxy
.'
resin
Date code is composed of 2-digit to DIN standard and the,following First week :1 Second week : 2 Third weed : 3 Fouth week : 4 Fifth, Sixth week : 5
number marked weekly code
according .
UNIT Name rawin
0.
:l/lmm PC3Q64 Outline Dimensions
cy5888KO2
1
SHARP
Fig. 1 Forward ambient current vs. temperature Fig. 2 Diode power vs. ambient
Page 6
dissipation temperature
-`Tr
Fig . 3 .a
0
'!'~"(oC)
Ambient2~empe~~tu~~
4 .2 n
Fig. -
Ambitnt 4
fzmperature
55 75
100
Ta ("C)
Collector power dissipation vs. ambient temperature
Total power vs. ambient
dissipation temperature
200
150 100 \ \ 100 -50 -1501
-30 Ambiint 5 Peak
VS.
"l
*
?zrnpe?\tuJ:
T'aoo("C)
forward current duty ratio Pulse width
S 100~ Ta = 25C
Duty
ratio
I
4. Reliability The reliability of products shall be satisfied Confidence
! /
PC3Q64
I
7
with level
items
listed
below. : 10%/20%
: 90%, LTPD
Test
Items
Test
Conditions ]
Failure Judgement Criteria
Samples (n)l Defective(C) n=ll, n=ll, n=ll, 1 n=ll,
i
j Solderability Soldering Terminal (Bending) Mechanical Variable vibration Temperature cycling
i
*l heat strength *3 shock frequency *2
i 23O"C, i 260C, ' , I 1 / /
5s 10 s
, I ! 1 ; VF > u x 1.2 I / j I CEO `, u x 2 I IC < L x 0.7 'CE(sat) >ux1.2 j , jU: i
C=O C=O C=O C=O C=O
Weight : lNtO.lkgf] 1 time/each terminal 15000m/s2{1500G], 0.5ms 3 times/?X, ?Y, ?Z direction min.
i 100 2, 2000 s 100 Hz/4 j 4 times/X,Y,Z direction 1 200m/s2t20G] : 1 cycle
-40C Q, +125"C (30min.) (30min.) j 20 cycle test i +85"C,
I
] n=ll, 9 1 ! i n=22, !
C=()
High temp. and high humidity storage High temp. storage storage life
85%RH, lOOOh
500h
Upper specification.
limit
n=22, I n=22,
C=O C=O C=O C=O !
1 +125"C, i -4O"C, /
:L: Low temp. Operation *1 *2 *3 lOOOh / I I ' Ta=25"C, IF=?5OmA Ptot=l-/OmW, lOOOh / adhere at the hole or other depth pins. dipped (Refer direction
Lower specification limit
n=22, n=22,
Solder shall lead and pin The lead pin root of lead Terminal
area of 95% or more of immersed holes shall not be concentrated into solder shall to the below) is shown below. be away 0.2mm
portion of on one portion. from the
bending
Weight
: lNfO.lkgf)
I
5. Incoming 5.1 (1) inspection Inspection Electrical VFY ICE09 (2) Aplpearance items characteristics VCE(sat J, Ic, Riso, Viso
IMODEL rb.
IPAGE
PC3Q64
I
8
5.2
Sampling
method
and Inspection
level
A single sampling plan, MIL-STD-105D is applied. items are shown below. Defect 1 Inspection Electrical Unreadable
normal inspection The AQL according
level to
II the
based on inspection
item
I 1 Inspection ! i ! I 1 Normal inspection
level I II j ! ! I j
AQL(%)
Major defect
characteristics marking
0.1
Minor defect
Appearance the above
defect except mensioned.
Normal inspection
II
0.4
MODEL Noa
PAGE
PC3Q64
9
6.2
Package Taping Tape
specifications conditions structure and (Refer to the attached sheet, Page 10)
6.2.1 (1)
Dimensions in which a cover hard vinylchloride tape is sealed heatto protect against
The tape shall pressed on the static electricity.
have a structure carrier tape of
(2)
Reel
structure
and
Dimensions
(Refer
to
the
attached with
sheet, its
Page dimensions
11)
The taping reel as shown in the
shall be of corrugated attached drawing. insertion carrier tape. (Refer tape shall
cardboard
(3)
Direction
of
product
to
the direct
attached to the
sheet, anode
Page mark
11)
4
Product direction in the hole side on the
at
(4)
Joint The
of cover
tape tape to repair and carrier taped tape failure in one reel sha 11 be joint less.
(5)
The way
devices of the carrier cutting tape portion
The way to repair tap'ed failure devices cut a bottom and after replacing to good devices, with a cutter, shall be sealed with adhesive tape.
6.2.2
Adhesiveness The exfoliation 0.2Ni20gf)s
of
cover
tape between the carrier tape and cover angle from 160" to 180". tape shall be
force lN{lOOgf]for and
6.2.3
Rolling
method
quanfity
Wind the tape back on the reel so that the cover tape will be outside Attach more than 20cm of blank tape to the trailer and the the tape. leader of the tape and fix the both ends with adh sive tape. One reel shall contain 1000 PCS.
6.2.4
Marking The outer packaging No. condition shall be stored at the humidities lower during shipping component or degradation of electrical the tempera ure than 70ZRH. lower than case * Number shall of be marked pieces delivered with following * Production information. date
* Model
6 -2.3 -
Storage
Taped procuts 5 `L 30C and
6.2.6
Safety
protection
There shall characteristecs
be no deformation of due to shipping.
SHARI=
Tape structure
and Dimensions
Page 10
I
5" max
Dimension
list
(Unit t D
:`mm) E F
G
1
A
i
C
Ii )1.5'>'
I LO.8+-O. 1
I 24. oto. 3 I 11. 5?0. 1 I 1.75+0. 1 12.OYJ.l 2.0+0.1 4.WO.I 10.4io. 05 I 3. 1 I 7.4iO.l oio.
SHARI=
Reel structure and DimensTons
Page 11
Dimension a b.
list
(Unit
: mm) d
330 25.5Al.5
f lO;!l. 0 1310. 5 23:l. 0 2.010.5
2. Ok 5
Direction
of product
insertion
Pull-out
direction
MODEL
I'b.
PAGE
PC3Q64
12
Precautions
for
Soldering
Photocouplers
I.
If
solder
reflow:
be done at the It is recommended that only one soldering the temperature profile as temperature and the time within shown in the figure.
L--
,
2 min. --__-_--
--; Ii37 , ! * 1 min:' '1.5 min.
i;
c i
1 min.
`!1
2.
Other
precautions lamp used to heat up for soldering may cause a temperature rise in the resin. So keep the package within that specified in Item 1. Also avoid immersing part in the solder.
An infrared localized temperature the resin

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